Lee Burlew is an Electrical Engineering Consultant with more than 35 years of electrical engineering experience. Most of his experience has been in system, subsystem and component electrical design for copier or printer products.
He is able to bring this very extensive level of experience to consulting or contracting of electrical system, subsystem or component designs. He is able to provide the required level of integration, analysis and testing of deliverable electrical hardware and provide the required documentation.

Profile

System Design:
System level requirements are defined for the interfaces with the mechanical, electronic and software designs and customer interfaces for the product or equipment.

System level requirements to meet international product safety, electromagnetic compatibility, AC power interfaces, power conservation and other external requirements are researched, defined and documented.

System level electrical design architectures are established that meet all the requirements and a detailed system design is determined.

Subsystem Design:
Subsystem level requirements are defined for all interfaces between the subsystems and the system design.

Subsystem electrical designs are defined, breadboarded, tested and integrated into the system design.

Design specifications, drawings and supporting documentation are generated documenting the design. This design documentation is generated in the required formats for product release or for non-released equipment designs.

Well-documented, detailed Engineering Notebooks are maintained and delivered for all subsystem and system designs.

Component Design:
All components required for the subsystem and system designs are researched to find the most appropriate component that meets the cost and reliability goals for the design.
Vendor liaison is provided to obtain the latest vendor information, component availability and product safety approval status for the components.
The components are integrated into the subsystem design and evaluated against the documented requirements for the components and the subsystem containing the components.